Xilinx (Page 2 of 5)

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Issue: October 2005

Xilinx (Page 2 of 5)

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Lower Power at Realistic Junction Temperatures
Temperature and power consumption are inter-dependent. This is critical for static power as leakage current increases with temperature. FPGA Designers for networking, wireless, storage and other applications have ambient temperatures in the chassis that significantly exceed room temperature - this leads to junction temperatures of 85 deg-C and beyond for many systems. Any power consumption data acquisition and comparison must be done at least at Tj=85 deg-C. Competitive comparisons at lower junction temperatures (e.g., 25 deg-C) are insufficient and not indicative of realistic operating conditions.

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